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odel B0205F50 00AHF  
Rev A
Mounting Configuration:
 
 
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
 
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
 
To supply common mode voltage offset to the analog-to-digital converter, DC blocking capacitors are
needed at the balanced port (pins 6 & 8).
 
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the
transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying
pick and place equipment tolerances.
 
 
   
 
 
 
 
 
 
 
 
 
Circuit Pattern
Footprint Pad (s)
Solder Resist
1.01 2x
4.02
.29 6x
.21 4x
.36 10x
.29 10x
3x
Transmission
Line
Plated thru
hole(s) to
Ground
1.66 2x
.89 4x
PART ORIENTATION (TOP VIEW)
Mounting Footprint
Dimensions are in Millimeters
 
 
   
 
 
 
 
 
 
 
 
相关PDF资料
B0310J50100AHF XFRMR BALUN RF 300-1000MHZ 0805
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B0809J50ATI XFRMR BALUN RF 850-915MHZ 0805
B0922J7575A50HF XFRMR BALUN RF 950-2150MHZ 0805
B0922N7575AHF XFRMR BALUN RF 950-2150MHZ 0404
BD0205F5050AHF XFRMR BALUN RF 70-1000MHZ 1608
BD0810J50100AHF XFRMR BALUN RF 800-1000MHZ 0805
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